Infinity Bond EP H20E-SP Epoxy Syringes Pre-Mixed and Frozen Choose Size:3cc Syringe (Pre-Mixed and Frozen) ASI FS 500 TDS

ASI FS 500 TDS

EPDM O-Ring Piston (Large side)

or atmospheric moisture

this industrial-grade adhesive is ideal for vertical surfaces

UX1012 MSDS

Infinity Bond EP H20E-SP Epoxy Syringes Pre-Mixed and Frozen Choose Size:3cc Syringe (Pre-Mixed and Frozen) ASI FS 500 TDSInfinity Bond EP H20E SP Epoxy Syringes Pre Mixed and Frozen Infinity Bond EP H20E SP is a two component, silver filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is used for thermal management applications due to its high thermal conductivity. It is used for opto electronic packaging material LED, LCDs, and fiber optic components. Infinity Bond EP H20E SP is suggested for plastic IC